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    RENESAS ELECTRONICS

    Price wars hurt payment firms; CG Power’s fab play falters

    Happy Friday! Payment aggregators are slashing fees to stay in the game. This and more in today’s ETtech Morning Dispatch.

    CG Power’s chip plans rocked by turmoil at wafer company Wolfspeed

    The potential bankruptcy of American Silicon Carbide (SiC) wafer maker Wolfspeed could have ripple effects on India's semiconductor ecosystem, particularly Murugappa group-owned CG Power's upcoming chip facility in Sanand.

    TSMC declined India’s invitation to set up plant: Report

    Taiwan Semiconductor Manufacturing Company declined India's plant invitation. India then partnered with Powerchip Semiconductor Manufacturing Corporation. They will build a wafer plant with Tata Electronics. TSMC is expanding in the US, Japan, and Germany. India is progressing towards chip manufacturing. Six chip fabrication facilities are approved. HCL and Foxconn have a joint venture.

    New chip on the block: UP will host HCL-Foxconn JV

    The Rs 3,706 crore HCL-Foxconn OSAT joint venture, approved by the Cabinet, will set up a semiconductor packaging facility in Jewar, Uttar Pradesh, to produce display driver chips. As India’s sixth semiconductor unit, it boosts localisation in smartphone manufacturing and marks a major milestone under the India Semiconductor Mission.

    New chip on the block: Uttar Pradesh to host HCL-Foxconn JV

    India's smartphone manufacturing gets a boost. HCL and Foxconn are partnering for a semiconductor assembly and test unit. The plant will be in Uttar Pradesh. It will produce display driver chips. This move supports India's localization efforts. The unit aims to meet a significant portion of India's display driver demand. Production is expected to start in 2027.

    HCL-Foxconn plant cleared; Airbnb’s India play

    The Union Cabinet has cleared the sixth chipmaking facility under the India Semiconductor Mission. This and more in today’s ETtech Top 5.

    The Economic Times
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